Moulded Interconnect Devices (MID) are a class of electronic packaging technologies that combine interconnects and electrical components into intricate, three-dimensional structures using injection moulding. Devices like cell phones, medical equipment, and car sensors can all be made compact, light, and inexpensively using MIDs. In order to create MIDs, interconnects and electronic components are arranged in a mould and then a thermoplastic substance is injected around them. The electronic parts and the interconnects are combined into a single, integrated package that is the final construction. Twenty percent of the world market for printed circuit boards is made up of moulded connecting devices.
The market for moulded interconnect devices (MID) is driven by the growing need across many industries, including consumer electronics, automotive, and healthcare, for the integration and miniaturisation of electronic components. MID technology makes it possible to compactly and affordably design intricate electronic circuits with a high degree of precision.
The market for MIDs is also being driven by the expanding use of the internet of things (IoT) and the growing requirement for wireless connection in a variety of applications.
Research Methodology:
After secondary research provided a fundamental understanding of the worldwide Molded Interconnect Device (MID) Market scenario, extensive primary research was carried out. A number of primary interviews were carried out with industry experts from the supply and demand sides, including C- and D-level executives, product managers, and marketing and sales managers of major manufacturers, distributors, and channel partners from tier 1 and tier 2 companies offering Molded Interconnect Device (MID) Market, as well as personnel from academia, research, and CROs. These interviews were conducted across five major regions: North America, Europe, Asia Pacific, and the Rest of the World (Latin America & the Middle East & Africa). Participants from the supply-side and demand-side participated in about 70% and 30% of the primary interviews, respectively. Through the use of questionnaires, emails, online surveys, in-person interviews, and phone interviews, this main data was gathered.
Molded Interconnect Device (MID) Market based on Product Type:
- Antennae & Connectivity Modules
- Sensors
- Connectors & Switches
- Lighting Systems
- Others
Molded Interconnect Device (MID) Market based on Process:
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Film Techniques
Molded Interconnect Device (MID) Market, by Vertical:
- Telecommunications
- Consumer Electronics
- Automotive
- Medical
- Industrial
- Military & Aerospace
Molded Interconnect Device (MID) Market based on Geography:
- North America
- Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe (RoE)
- Asia Pacific (APAC)
- China
- Japan
- India
- Australia
- South Korea
- Rest of Asia Pacific (RoAPAC)
- Latin America (LATAM)
- Brazil
- Argentina
- Rest of South America
- Middle East and Africa (MEA)
- UAE
- Turkey
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
MID sensors are used in the automotive and industrial sectors. MID is utilised in industrial applications for temperature and pressure sensors, among other sensors.
Sensors are being used in temperature control applications and adaptive cruise control systems as automobile technology advances. MID sensors would be in higher demand throughout the forecast period due to the growing usage of MIDs in various applications.
In 2030, the moulded interconnect device (MID) business is anticipated to be accounted for by laser direct structuring (LDS). The machinery used to make MIDs is LDS equipment. LDS is made up of several processes, including metallization, injection moulding, laser activation, and assembly. LDS equipment is made only by LPKF Laser & Electronics.The process of LDS is three steps. First, one of the LDS resins is used to mould the antenna in a typical single-shot mould. Using a 3D laser technology, the desired pattern is formed directly onto the antenna in the second step. In order to create a conductive design, the pattern is then plated using industry-standard techniques, adhering to the plastic only in the areas where the plastic has been activated by laser.
Over the course of the projected period, Asia Pacific is anticipated to experience the greatest CAGR. In terms of market share, the Asia Pacific region leads the moulded interconnect device (MID) sector. This is mostly attributable to a number of OEMs, as well as Asia Pacific-based producers of semiconductor devices and products. The area, particularly from nations like Taiwan, South Korea, and China, has excelled in providing the most cutting-edge semiconductor fabrication services as well as electronic system assembly services. Furthermore, outsourcing the manufacturing of their goods to nations like China and Taiwan offers semiconductor electronics companies a significant cost advantage.
- This report illustrates the most vital attributes of the Molded Interconnect Device (MID) Market, which are driving and providing opportunities.
- This research gives an in-depth analysis of the Molded Interconnect Device (MID) Market growth on the basis of several segments in the market.
- This report presents the predictions of the past and present trends of the Molded Interconnect Device (MID) Market.
- This study also presents the competitive analysis, such as key strategies and capabilities of major players of the Molded Interconnect Device (MID) Market.
Methodology
Infoholic Research works on a holistic 360° approach in order to deliver high quality, validated and reliable information in our market reports. The Market estimation and forecasting involves following steps:
- Data Collation (Primary & Secondary)
- In-house Estimation (Based on proprietary data bases and Models)
- Market Triangulation
- Forecasting
List of Tables
TABLE 1. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 2. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR ANTENNAE & CONNECTIVITY MODULES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 3. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR SENSORS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 4. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONNECTORS & SWITCHES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 5. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LIGHTING SYSTEMS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 6. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR OTHERS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 7. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 8. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LASER DIRECT STRUCTURING (LDS), 2021-2030 (USD BILLION)
TABLE 9. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TWO-SHOT MOLDING, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 10. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR FILM TECHNIQUES, 2021-2030 (USD BILLION)
TABLE 11. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY VERTICAL, 2021-2030 (USD BILLION)
TABLE 12. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TELECOMMUNICATIONS, 2021-2030 (USD BILLION)
TABLE 13. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONSUMER ELECTRONICS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 14. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR AUTOMOTIVE, 2021-2030 (USD BILLION)
TABLE 15. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MEDICAL, 2021-2030 (USD BILLION)
TABLE 16. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR INDUSTRIAL, 2021-2030 (USD BILLION)
TABLE 17. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MILITARY & AEROSPACE, 2021-2030 (USD BILLION)
TABLE 18. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 19. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 20. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 21. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 22. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 23. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 24. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 25. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 26. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 27. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 28. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 29. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 30. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 31. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 32. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 33. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 34. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 35. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 36. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 37. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 38. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 39. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 40. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 41. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 42. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 43. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 44. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 45. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 46. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 47. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 48. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 49. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 50. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 51. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 52. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 53. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 54. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 55. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 56. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 57. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 58. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 59. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 60. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 61. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 62. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 63. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 64. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 65. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 66. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 67. MOLEX (US): FINANCIALS
TABLE 68. MOLEX (US): PRODUCTS & SERVICES
TABLE 69. MOLEX (US): RECENT DEVELOPMENTS
TABLE 70. TE CONNECTIVITY (SWITZERLAND): FINANCIALS
TABLE 71. TE CONNECTIVITY (SWITZERLAND): PRODUCTS & SERVICES
TABLE 72. TE CONNECTIVITY (SWITZERLAND): RECENT DEVELOPMENTS
TABLE 73. AMPHENOL CORPORATION (US): FINANCIALS
TABLE 74. AMPHENOL CORPORATION (US): PRODUCTS & SERVICES
TABLE 75. AMPHENOL CORPORATION (US): RECENT DEVELOPMENTS
TABLE 76. LPKF LASER & ELECTRONICS (GERMANY): FINANCIALS
TABLE 77. LPKF LASER & ELECTRONICS (GERMANY): PRODUCTS & SERVICES
TABLE 78. LPKF LASER & ELECTRONICS (GERMANY): RECENT DEVELOPMENTS
TABLE 79. HARTING (GERMANY): FINANCIALS
TABLE 80. HARTING (GERMANY): PRODUCTS & SERVICES
TABLE 81. HARTING (GERMANY): RECENT DEVELOPMENTS
TABLE 82. ARLINGTON PLATING COMPANY (US): FINANCIALS
TABLE 83. ARLINGTON PLATING COMPANY (US): PRODUCTS & SERVICES
TABLE 84. ARLINGTON PLATING COMPANY (US): RECENT DEVELOPMENTS
TABLE 85. MID SOLUTIONS (GERMANY).: FINANCIALS
TABLE 86. MID SOLUTIONS (GERMANY).: PRODUCTS & SERVICES
TABLE 87. MID SOLUTIONS (GERMANY).: RECENT DEVELOPMENTS
TABLE 88. 2E MECHATRONIC (GERMANY): FINANCIALS
TABLE 89. 2E MECHATRONIC (GERMANY): PRODUCTS & SERVICES
TABLE 90. 2E MECHATRONIC (GERMANY): RECENT DEVELOPMENTS
TABLE 91. KYOCERA AVX (US): FINANCIALS
TABLE 92. KYOCERA AVX (US): PRODUCTS & SERVICES
TABLE 93. KYOCERA AVX (US): RECENT DEVELOPMENTS
TABLE 94. TAOGLAS (DUBLIN): FINANCIALS
TABLE 95. TAOGLAS (DUBLIN): PRODUCTS & SERVICES
TABLE 96. TAOGLAS (DUBLIN): RECENT DEVELOPMENTS
